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Samsung showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year. Samsung’s revelations include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory, in accelerating the move toward the convergence of memory and logic. First integration of HBM-PIM into … More
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