This article has been indexed from MacRumors: Mac News and Rumors – Front Page
Newly surfaced detailed schematics for the iPhone 14 Pro and iPhone 14 Pro Max have been shared online by Max Weinbach, revealing that Apple’s upcoming high-end iPhones could feature a more prominent camera bump and a thicker overall design.
Last week, more basic schematics for the iPhone 14 Pro were shared, but the ones shared by Weinbach are more detailed and offer measurements for the upcoming iPhones. According to the schematics, the iPhone 14 Pro Max will measure 77.58 mm in width, slightly smaller than the iPhone 13 Pro Max at 78.1 mm. Also, according to the schematics, the iPhone 14 Pro Max will be nearly identical to the iPhone 13 Pro Max in height, measuring at 160.7 mm compared to 160.8 mm.
In thickness, the iPhone 14 Pro Max will measure 7.85 mm, slightly thicker than the current high-end iPhone, which measures just 7.65 mm. With the iPhone 13 Pro and iPhone 13 Pro Max, Apple considerably increased the size of the camera plateau on the back compared to the iPhone 12 Pro. In 2022, Apple is looking to repeat a similar trend.
The current camera bump on the iPhone 13 Pro Max is just 3.60 mm tall, according to guidelines created by Apple for accessory makers to follow. According to the iPhone 14 Pro Max schematics shared by Weinbach, the camera bump on the 2022 high-end iPhone will be 4.17 mm thick. The camera plateau itself on the back of the iPhone will also increase in size by about 5% in each dimension, going from the
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